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3g Thermal Paste – Provides a practical amount of thermal compound for CPU and other compatible cooling applications.
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Thermal Conductive Compound – Designed to help transfer heat from the processor or component to the heatsink.
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Improved Heat Transfer – Helps reduce thermal resistance between the chip surface and cooling solution.
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CPU Cooling Application – Suitable for use during CPU cooler installation and thermal paste replacement.
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Easy to Apply – Compact 3g packaging is convenient for application during PC maintenance or upgrades.
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Suitable for PC Maintenance – Useful when replacing dried or aged thermal compound.
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Compact Packaging – Easy to store and convenient to keep as part of a PC maintenance kit.
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Model: HY-P17-3
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Net Weight: 3g
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